Organic light-emitting display apparatus

ABSTRACT

An organic light-emitting display apparatus includes a substrate having a display area displaying an image and a periphery area. The periphery area is located next to the display area. A first organic insulating layer is disposed on the substrate. The first organic insulating layer includes a valley portion separating the first organic insulating layer from the periphery area. A plurality of organic light-emitting devices is disposed on the substrate. Each of the organic light-emitting devices includes a first electrode, an emission layer, and a second electrode, sequentially disposed over the first organic insulating layer. The second electrode covers the emission layer and the valley portion. A second organic insulating layer is disposed over the first organic insulating layer and incudes a first opening exposing a center portion of the first electrode and a second opening overlapping the valley portion. A capping layer covers the second electrode.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a Continuation of co-pending U.S. patent applicationSer. No. 16/992,738, filed on Aug. 13, 2020, which is a Division of U.S.patent application Ser. No. 15/937,305, filed on Mar. 27, 2018, whichclaims priority to and the benefit of Korean Patent Application No.10-2017-0041392, filed on Mar. 31, 2017, in the Korean IntellectualProperty Office, the disclosures of which are incorporated by referenceherein in their entirety.

TECHNICAL FIELD

The present disclosure relates to a display apparatus, and moreparticularly, to an organic light-emitting display apparatus.

DISCUSSION OF THE RELATED ART

An organic light-emitting display apparatus includes an organiclight-emitting diode (OLED) device including a hole injection electrode,an electron injection electrode, and an organic emission layer disposedbetween the hole injection electrode and the electron injectionelectrode. The organic light-emitting display apparatus is aself-emitting type display apparatus that generates light as it displaysan image. In the OLEDs, light is generated as holes, injected from thehole injection electrode, and electrons, injected from the electroninjection electrode, combine in the organic emission layer.

Since the organic light-emitting display apparatus does not need aseparate light source to display an image, the organic light-emittingdisplay apparatus may be driven at a low voltage, may be light-weightand thin, may have an excellent viewing angle, may have a high contrastratio, and may have a high response speed. Thus, the organiclight-emitting display apparatus may be used in all manner of personalportable devices (e.g. MP3 players and mobile phones) as well as largerelectronic devices such as televisions (TV) and computer monitors.

However, the image quality of OLED display devices may deteriorate as aresult of manufacture or during subsequent use as impurities, such as agas or moisture, introduced from an outside source or generated from anorganic material included in the organic light-emitting displayapparatus, infiltrate into an organic light-emitting device.

SUMMARY

An organic light-emitting display apparatus includes a substrate havinga display area, within which an image is displayed, and a peripheryarea, within which no image is displayed. The periphery area is locatednext to or surrounding the display area. A first organic insulatinglayer is disposed on the substrate within the display area and theperiphery area. The first organic insulating layer includes a valleyportion separating the first organic insulating layer from the peripheryarea. A plurality of organic light-emitting devices is disposed on thesubstrate. Each of the plurality of organic light-emitting devicesincludes, in the display area, a first electrode, an emission layer, anda second electrode, which are sequentially disposed over the firstorganic insulating layer. The second electrode covers the emission layerand the valley portion. A second organic insulating layer is disposedover the first organic insulating layer in the display area and theperiphery area, and incudes a first opening exposing a center portion ofthe first electrode and a second opening overlapping the valley portion.A capping layer covers the second electrode.

An organic light-emitting display apparatus includes a substrate havinga display area, within which an image is displayed using a plurality oforganic light-emitting devices. A valley portion is disposed on thesubstrate outside of the display area. The valley portion separates aregion of an organic insulating layer. A power supply line is disposedon the substrate outside of the display area and supplies power to theplurality of organic light-emitting devices. A dam portion is disposedon the substrate outside of the display area. A common electrode of theplurality of organic light-emitting devices, covers the display area andthe valley portion, and contacts the power supply line. A capping layercovers the common electrode. An encapsulation member is disposed overthe capping layer and incudes at least one organic film and at least oneinorganic film.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the present disclosure and many of theattendant aspects thereof will be readily obtained as the same becomesbetter understood by reference to the following detailed descriptionwhen considered in connection with the accompanying drawings, wherein:

FIG. 1 is a schematic plan view illustrating a part of an organiclight-emitting display apparatus, according to an exemplary embodimentof the present disclosure;

FIG. 2 is a schematic cross-sectional view illustrating a part of theorganic light-emitting display apparatus taken along a line II-II ofFIG. 1;

FIG. 3 is a cross-sectional view illustrating a structure in which anencapsulation member is formed in the organic light-emitting displayapparatus of FIG. 2;

FIG. 4 is a schematic plan view illustrating a part of an organiclight-emitting display apparatus;

FIG. 5 is a schematic cross-sectional view illustrating a part of theorganic light-emitting display apparatus taken along a line V-V of FIG.4;

FIGS. 6 through 9 are schematic plan views illustrating various modifieddesigns of a valley portion, a second electrode, and a capping layerformed in a first organic insulating layer with respect to an organiclight-emitting display apparatus, according to exemplary embodiments ofthe present disclosure;

FIG. 10 is a schematic plan view illustrating a part of an organiclight-emitting display apparatus, according to another embodiment; and

FIG. 11 is a schematic plan view illustrating a part of an organiclight-emitting display apparatus, according to an exemplary embodimentof the present disclosure.

DETAILED DESCRIPTION

In describing exemplary embodiments of the present disclosureillustrated in the drawings, specific terminology is employed for sakeof clarity. However, the present disclosure is not intended to belimited to the specific terminology so selected, and it is to beunderstood that each specific element includes all technical equivalentswhich operate in a similar manner.

In drawings, like reference numerals may refer to like elements. It maybe assumed that where detailed description of an element is notprovided, that element may be similar to or identical to correspondingelements described elsewhere in the disclosure.

It will be understood that when a component or layer is referred to asbeing “on” another component or layer, the component or layer can bedirectly on another component or layer or intervening component orlayers. In drawings, for convenience of description, sizes of componentsmay be exaggerated for clarity.

FIG. 1 is a schematic plan view illustrating a part of an organiclight-emitting display apparatus 1, according to an exemplary embodimentof the present disclosure, FIG. 2 is a schematic cross-sectional viewillustrating a part of the organic light-emitting display apparatus 1taken along a line II-II of FIG. 1, and FIG. 3 is a cross-sectional viewillustrating a structure in which an encapsulation member 160 is formedin the organic light-emitting display apparatus 1 of FIG. 2.

Referring to FIGS. 1 through 3, the organic light-emitting displayapparatus 1 according to an exemplary embodiment of the presentdisclosure includes a substrate 110 having a display area DA and aperiphery area PA (e.g., a non-display area), that is alongside oroutside of the display area DA. A valley portion 120 separates a firstorganic insulating layer 118. The first organic insulating layer 118operates as a planarization film and is formed outside of the displayarea DA. A second organic insulating layer 119 is formed of a samematerial as a pixel-defining layer. The second organic insulating layer119 may include a second opening 119 h 2 in the valley portion 120. Asecond electrode 135 (e.g., a common electrode) is disposed in thevalley portion 120. The second electrode 135 may cover the valleyportion 120. A capping layer 140 may cover the second electrode 135.

A structure of the second electrode 135 and the capping layer 140,formed around the valley portion 120, may prevent impurities, such as agas or moisture generated from an organic material included in theorganic light-emitting display apparatus 1, from infiltrating into theorganic light-emitting display apparatus 1.

The substrate 110 may be formed of a glass material, a metal material,and/or a plastic material. For example, the substrate 110 may be aflexible substrate including a polymer resin, such as polyethersulphone(PES), polyacrylate (PAR), polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethylene terephthalate (PET), polyphenylenesulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC), and/orcellulose acetate propionate (CAP).

The display area DA is an area where an image is displayed, and aplurality of first thin-film transistors TFT1 and a plurality of organiclight-emitting devices (OLEDs) 130 that are electrically connected tothe plurality of first thin-film transistors TFT1 may be disposed in thedisplay area DA.

A buffer layer 111, including an inorganic material such as siliconoxide (SiO), silicon nitride (SiN) and/or silicon oxynitride (SiON), maybe disposed between the first thin-film transistor TFT1 and thesubstrate 110. The buffer layer 111 may increase flatness of a topsurface of the substrate 110, and/or may prevent or reduce infiltrationof impurities into a semiconductor layer 122 through the substrate 110.

The first thin-film transistor TFT1 may include the semiconductor layer122, a gate electrode 124, a source electrode 126 s, and a drainelectrode 126 d, wherein the semiconductor layer 122 includes amorphoussilicon, polycrystalline silicon, and/or an organic semiconductormaterial.

The gate electrode 124 is disposed above the semiconductor layer 122.The source electrode 126 s and the drain electrode 126 d electricallycommunicate with each other according to a signal applied to the gateelectrode 124. The gate electrode 124 may include a single layer or mayhave a multilayer structure including aluminum (Al), platinum (Pt),palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni),neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca),molybdenum (Mo), titanium (Ti), tungsten (W), and/or copper (Cu), whileconsidering adhesion with an adjacent layer, and surface flatness andprocessability of a stacked layer.

To obtain insulation between the semiconductor layer 122 and the gateelectrode 124, a gate insulating film 113 may be disposed between thesemiconductor layer 122 and the gate electrode 124. The gate insulatingfilm 113 may include an inorganic material such as SiO, SiN, and/orSiON.

An interlayer insulating film 115 including an inorganic material, suchas SiO, SiN, and/or SiON, may be disposed above the gate electrode 124.The source and drain electrodes 126 s and 126 d may each be disposedover the interlayer insulating film 115. The source and drain electrodes126 s and 126 d may each be electrically connected to the semiconductorlayer 122 through a contact hole formed in the interlayer insulatingfilm 115 and the gate insulating film 113.

The source and drain electrodes 126 s and 126 d may each include asingle layer or may each have a multilayer structure including Al, Pt,Pd, Ag, Mg, Au, Ni, Nd, Ir, Cr, Li, Ca, Mo, Ti, W, and/or Cu.

A second thin-film transistor TFT2 may be disposed in the periphery areaPA of the substrate 110. The second thin-film transistor TFT2 may be apart of a circuit unit for controlling an electric signal applied in thedisplay area DA.

The second thin-film transistor TFT2 may have the same structure as thefirst thin-film transistor TFT1 described above. Alternatively, thesecond thin-film transistor TFT2 may have a different structure from thefirst thin-film transistor TFT1.

The second thin-film transistor TFT2 may be formed of the same materialas the first thin-film transistor TFT1. For example, the secondthin-film transistor TFT2 may include a semiconductor layer includingamorphous silicon, polycrystalline silicon, or an organic semiconductormaterial. Alternatively, the second thin-film transistor TFT2 may beformed of a different material from the first thin-film transistor TFT.

The first organic insulating layer 118 may be disposed over the firstthin-film transistor TFT1. When the OLED 130 is disposed above the firstthin-film transistor TFT1, the first organic insulating layer 118 mayoperate as a planarization film such that a first electrode 131 isformed flat above the first organic insulating layer 118. The firstorganic insulating layer 118 may be formed of an organic material, suchas acryl, benzocyclobutene (BCB), PI, or hexamethyldisiloxane (HMDSO).In FIG. 2, the first organic insulating layer 118 includes a singlelayer, but may alternatively have a multilayer structure.

The first organic insulating layer 118 is formed in both the displayarea DA and the periphery area PA. The first organic insulating layer118 includes the valley portion 120 that physically separates the firstorganic insulating layer 118 into first and second regions 118 a and 118b, in the periphery area PA. The valley portion 120 forms an inorganicfilm cliff so as to block impurities, such as gas G or moisture, fromcontaminating the display area DA through the first organic insulatinglayer 118.

In the display area DA, the OLED 130 includes the first electrode 131,the second electrode 135, and an intermediate layer 133. Theintermediate layer 133 may include an emission layer and may be disposedbetween the first and second electrodes 131 and 135. The intermediatelayer 133 may be disposed over the first organic insulating layer 118.

The first electrode 131 may be a transparent electrode or a reflectiveelectrode. When the first electrode 131 is a transparent electrode, thefirst electrode 131 may include a transparent conductive layer.

The transparent conductive layer may include indium tin oxide (ITO),indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In₂O₃), indiumgallium oxide (IGO), and/or aluminum zinc oxide (AZO). The firstelectrode 131 may further include a semi-transmission layer forincreasing light efficiency, in addition to the transparent conductivelayer. The semi-transmission layer may include a thin film of Ag, Mg,Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, and/or YB and may have athickness of between 2 nm and 144 nm.

When the first electrode 131 is a reflective electrode, the firstelectrode 131 may include a reflective film formed of Ag, Mg, Al, Pt,Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof, and a transparentconductive layer disposed above and/or below the reflective film. Thetransparent conductive layer may include ITO, IZO, ZnO, In₂O₃, IGO,and/or AZO.

However, the first electrode 131 is not limited thereto, and may includevarious other materials, and may have any one of various structures,such as a single layer structure or a multilayer structure.

The second organic insulating layer 119 may be disposed over the firstorganic insulating layer 118, throughout the display area DA and theperiphery area PA.

An opening 119 h 1 of the second organic insulating layer 119 exposing acenter portion of the first electrode 131 defines a pixel. The secondorganic insulating layer 119 may cover an edge of the first electrode131 to prevent an arc of electricity from being generated at the edge ofthe first electrode 131.

The second organic insulating layer 119 may be formed of an organicmaterial, such as PI or HMDSO. The second organic insulating layer 119may be formed of the same material or a different material as the firstorganic insulating layer 118.

The second organic insulating layer 119 includes the second opening 119h 2 exposing the valley portion 120 formed in the first organicinsulating layer 118, in the periphery area PA. Like the valley portion120 formed in the first organic insulating layer 118, the second opening119 h 2 forms an organic film cliff, thereby blocking impurities, suchas the gas G or moisture, from infiltrating into the display area DAthrough the second organic insulating layer 119.

The intermediate layer 133 of the OLED 130 may include a low molecularweight or polymer material.

When the intermediate layer 133 includes a low molecular weightmaterial, the intermediate layer 133 may have a structure in which ahole injection layer (HIL), a hole transport layer (HTL), an emissionlayer (EML), an electron transport layer (ETL), and an electroninjection layer (EIL) are stacked on each other in a single-layer or amulti-layer structure. The intermediate layer 133 may include copperphthalocyanine (CuPc), N,N′-di(naphthalene-1-yl)-N,N′-diphenyl-benzidine(NPB), and/or tris-8-hydroxyquinoline aluminum (Alq3). The intermediatelayer 133 may be formed by various methods, such as a vacuum depositionmethod.

When the intermediate layer 133 includes a polymer material, theintermediate layer 133 may include an HTL and an EML. Here, the HTL mayinclude PEDOT, and the EML may include a poly-phenylenevinylene(PPV)-based polymer material or a polyfluorene-based polymer material.The intermediate layer 133 may be formed by various methods, such as ascreen printing method, an inkjet printing method, or a laser-inducedthermal imaging (LITI) method.

The intermediate layer 133 may include a layer integrated throughout theplurality of first electrodes 131, or may include a layer patternedaccording to each of the plurality of first electrodes 131.

The second electrode 135 is formed throughout the display area DA andthe periphery area PA. The second electrode 135 may be disposed abovethe intermediate layer 133 and the second organic insulating layer 119,inside of the second opening 119 h 2 of the second organic insulatinglayer 119, and inside of the valley portion 120 of the first organicinsulating layer 118. The second electrode 135 may form a commonelectrode by being integrally formed with the plurality of OLEDs 130.

The second electrode 135 may be a transparent electrode or a reflectiveelectrode.

When the second electrode 135 is a transparent electrode, the secondelectrode 135 may include Ag, Al, Mg. Li, Ca, Cu, LiF/Ca, LiF/Al, MgAg,and/or CaAg, and have a form of a thin film having a thickness of 2 nmto 144 nm.

When the second electrode 135 is a reflective electrode, the secondelectrode 135 may include Ag, Al, Mg, Li, Ca, Cu, LiF/Ca, LiF/Al, MgAg,and/or CaAg. However, a structure and material of the second electrode135 are not limited thereto, and may vary.

The capping layer 140 may be disposed above the second electrode 135.The capping layer 140 may protect a light-emitting device and mayincrease light generating efficiency.

The capping layer 140 may include a plurality of layers, such as a layerincreasing light efficiency and a layer protecting a light-emittingdevice. For example, the capping layer 140 may include, in order toincrease light efficiency, one or more organic or inorganic materials,such SiO, SiN, ZnO₂, TiO₂, ZrO₂, ITO, IZO, Alq3, CuPc, CBP, a-NPB,and/or ZiO₂. According to an exemplary embodiment of the presentdisclosure, the capping layer 140 may generate a Plasmon resonancephenomenon with respect to light generated by the OLED 130. For example,the capping layer 140 may include nano-particles.

The capping layer 140 may prevent the OLED 130 from being damaged byheat or plasma generated during a chemical vapor deposition (CVD)process or a sputtering process performed to form the encapsulationmember 160. For example, the capping layer 140 may include anepoxy-based material including bisphenol-type epoxy resin, epoxidizedbutadiene resin, fluorine-type epoxy resin, and/or novolac epoxy resin.

The capping layer 140 may have a larger area than that of the secondelectrode 135 such that an end of the second electrode 135 is covered.When the CVD process or sputtering process for forming the encapsulationmember 160 is performed while the capping layer 140 is not covering theend of the second electrode 135, it may be difficult to preventoxidization of the second electrode 135.

The capping layer 140 including the organic material may be a passagefor diffusing moisture or a gas inside the organic light-emittingdisplay apparatus 1. However, according to an exemplary embodiment ofthe present disclosure, the second electrode 135 passes the display areaDA and extends in a direction towards the outside of the organiclight-emitting display apparatus 1 up to the valley portion 120 formedin the first organic insulating layer 118, and extends up to the secondopening 119 h 2 formed in the second organic insulating layer 119outside of the valley portion 120. Accordingly, the second electrode 135blocks the gas G or moisture generated from the first or second organicinsulating layer 118 or 119, and thus diffusion of impurities by thecapping layer may be prevented.

FIG. 4 is a schematic plan view illustrating a part of an organiclight-emitting display apparatus 2, according to an exemplary embodimentof the present invention, and FIG. 5 is a schematic cross-sectional viewof a part of the organic light-emitting display apparatus 2 taken alonga line V-V of FIG. 4.

In drawings, like reference numerals may denote like elements, and tothe extent that elements of the organic light-emitting display apparatus2 is not described herein, it may be assumed that these non-describedelements are at least similar to corresponding elements described withrespect to the organic light-emitting display apparatus 1.

Referring to FIGS. 4 and 5, in the organic light-emitting displayapparatus 2, a second electrode 235 is disposed inside of the valleyportion 120 that faces the display area DA.

In the organic light-emitting display apparatus 2, the first organicinsulating layer 118 includes the valley portion 120. The valley portion120 physically separates the first organic insulating layer 118 intofirst and second regions 118 a and 118 b, in the periphery area PA. Thevalley portion 120 forms an organic film cliff so as to preventimpurities, such as the gas G or moisture, from being transmittedthrough the first organic insulating layer 118.

The second organic insulating layer 119 includes the second opening 119h 2 exposing the valley portion 120 formed in the first organicinsulating layer 118, in the periphery area PA. The second opening 119 h2 forms the organic film cliff like the valley portion 120 formed in thefirst organic insulating layer 118 so as to prevent transmission ofimpurities, such as the gas G or moisture, through the second organicinsulating layer 119.

However, in this example, the second electrode 235, e.g., a commonelectrode, is disposed inside of the valley portion 120 facing thedisplay area DA. The capping layer 140 covers the second electrode 235.When the capping layer 140 is disposed outside of the valley portion120, the gas G diffused through the first or second organic insulatinglayer 118 or 119 is not blocked by the second electrode 235, but may bediffused along the capping layer 140 including an organic material. Thegas G diffused along the capping layer 140 is transmitted to the firstand second organic insulating layer 118 and 119 inside of the valleyportion 120. The impurities, such as the gas G or moisture, transmittedas such may cause deterioration of the OLED 130 of the display area DA.

However, in this embodiment, since the second electrode 135 (see FIG. 2)extends up to the valley portion 120 formed in the first organicinsulating layer 118 in a direction towards the outside of the organiclight-emitting display apparatus 1, and extends up to the second opening119 h 2 of the second organic insulating layer 119 outside of the valleyportion 120, it would be difficult for the gas of the first or secondorganic insulating layer 118 or 119 to be diffused through the cappinglayer 140. Even if the gas diffuses through the capping layer 140, theOLED 130 is covered by the second electrode 135, and thus deteriorationof the OLED 130 may be prevented.

Referring back to FIGS. 1 through 3, a first power supply line 170 and asecond power supply line 171, which supply power to the OLED 130, aredisposed outside of the valley portion 120 of the periphery area PA.

The first power supply line 170 may be a low voltage power source. Thefirst power supply line 170 is connected to the second electrode 135through a connection conductive layer 150 to apply low voltage power tothe OLED 130.

The first power supply line 170 may surround the display area DA. In thecurrent embodiment, the first power supply line 170 surrounds thedisplay area DA in a shape of “U”, but the invention is not limited tothis particular arrangement. The first power supply line 170 may beformed on any side of the display area DA.

The second power supply line 171 may be a high voltage power source. Thesecond power supply line 171 is directly connected to the display areaDA and may apply high voltage power to the OLED 130.

The OLED 130 may be connected to an external power supply apparatusthrough a pad unit PAD connected to the first and second power supplylines 170 and 171. The connection conductive line 150 may be disposedabove the first organic insulating layer 118 and inside of the valleyportion 120, in the periphery area PA. The connection conductive line150 is disposed on the same layer as the first electrode 131, and atleast a part of the connection conductive line 150 may be disposedbetween the first and second organic insulating layers 118 and 119. Theconnection conductive line 150 may be formed of the same material as thefirst electrode 131, and may completely cover the valley portion 120.

According to an exemplary embodiment of the present disclosure, theconnection conductive line 150 includes a plurality of third openings150 h 3 disposed around the valley portion 120. The second organicinsulating layer 119 may include a fourth opening 119 h 4 exposing atleast a part of the connection conductive line 150.

The second organic insulating layer 119 may be separated into aplurality of regions by the fourth opening 119 h 4. The third openings150 h 3 included in the connection conductive line 150 may operate aspaths for externally discharging a gas generated from the first organicinsulating layer 118 formed of an organic material below the connectionconductive line 150. Accordingly, infiltration of the gas generated fromthe first organic insulating layer 118 into the display area DA may beprevented, and thus deterioration of quality of an image realized by theorganic light-emitting display apparatus 1 may be prevented or reduced.

The fourth opening 119 h 4 of the second organic insulating layer 119may expose the connection conductive line 150. The second electrode 135disposed over the second organic insulating layer 119 may contact theconnection conductive line 150 through the fourth opening 119 h 4. Theconnection conductive line 150 is connected to the first power supplyline 170 supplying power to the second electrode 135.

The valley portion 120 formed in the first organic insulating layer 118may surround the display area DA. In the current exemplary embodiment ofthe present disclosure, the valley portion 120 surrounds the displayarea DA in a shape of “U”, but the invention is not limited to thisparticular configuration. The first organic insulating layer 118 may bephysically and spatially separated into the first and second regions 118a and 118 b by the valley portion 120. Similarly, the second organicinsulating layer 119 may be separated into at least two regions by thesecond opening 119 h 2 that is located to correspond to the valleyportion 120.

A width W2 of the second opening 119 h 2 included in the second organicinsulating layer 119 may be larger than a width W1 of the valley portion120 included in the first organic insulating layer 118. Accordingly, thesecond organic insulating layer 119 might not be provided in the valleyportion 120.

The connection conductive line 150 may also surround the display area DAin the periphery area PA, and cover the valley portion 120. Theconnection conductive line 150 may include the plurality of thirdopenings 150 h 3 disposed around the valley portion 120.

The second electrode 135 is provided throughout the display area DA andthe periphery area PA, and may completely cover the valley portion 120.The second electrode 135 may directly contact the connection conductiveline 150 in the valley portion 120.

A part of the connection conductive line 150 may completely cover thevalley portion 120 while another part of the connection conductive line150 is disposed between the first and second organic insulating layers118 and 119. Alternatively, the connection conductive line 150 may covera part of the valley portion 120. However, the connection conductiveline 150 may cover at least a part of the valley portion 120 throughouta region surrounding the display area DA.

Referring to FIG. 3, the encapsulation member 160 may include at leastone inorganic film and at least one organic film. For example, anorganic film may be disposed over the capping layer 140.

The encapsulation member 160 may cover the display area DA and mayextend up to the periphery area PA. As shown in FIG. 3, theencapsulation member 160 may include a first inorganic layer 161, anorganic layer 163, and a second inorganic layer 165.

The first inorganic layer 161 may cover the capping layer 140 and mayinclude SiO, SiN, and/or SiON. A layer including LiF may be disposedbetween the first inorganic layer 161 and the capping layer 140.

Since the first inorganic layer 161 is formed above a structure, a topsurface of the first inorganic layer 161 might not be flat. The organiclayer 163 may cover the first inorganic layer 161 that is not flat, anda top surface of the organic layer 163 may be more flat than the firstinorganic layer 161. The organic layer 163 may include PET, PEN, PC, PI,polyethylene sulfonate, polyoxymethylene, polyarylate, PAR, and/orHMDSO.

The second inorganic layer 165 covers the organic layer 163 and mayinclude SiN, SiN, and/or SiON. The second inorganic layer 165 maycontact the first inorganic layer 161 at an edge region of the organiclight-emitting display apparatus 1 such that the organic layer 163 isnot exposed outside of the organic light-emitting display apparatus 1.

As such, the encapsulation member 160 may include the first inorganiclayer 161, the organic layer 163, and the second inorganic layer 165.Accordingly, even when the encapsulation member 160 is cracked, cracksare not connected between the first inorganic layer 161 and the organiclayer 163 or between the organic layer 163 and the second inorganiclayer 165. Accordingly, external moisture or oxygen may be prevented orreduced from being infiltrated into the display area DA.

A first dam portion 180 and a second dam portion 190 are disposedoutside of the first and second power supply lines 170 and 171. Althoughnot shown in FIG. 1, the first and second dam portions 180 and 190 maysurround the display area DA.

The first and second dam portions 180 and 190 prevent the organic layer163 from leaking to the periphery area PA.

The first dam portion 180 may have a structure in which the secondorganic insulating layer 119 and a spacer 129 are stacked on each other.However, the present invention is not limited to this particulararrangement, and the first dam portion 180 may be formed of differentmaterials and may have different heights from the second organicinsulating layer 119 and spacer 129. For example, the first dam portion180 may have a structure in which the first and second organicinsulating layers 118 and 119 are stacked on each other.

The second dam portion 190 may have a structure in which the firstorganic insulating layer 118, the second organic insulating layer 119,and the spacer 129 are stacked on each other. However, the presentinvention is not limited to this particular arrangement, and the seconddam portion 190 may be formed of different materials and have differentheights from the first insulating layer 118, the second organicinsulating layers 119, and the spacer 129.

The first organic insulating layer 118 of the second dam portion 190 maycover an end of the first power supply line 170 so as to preventdeterioration of the first power supply line 170 during backplanemanufacture that uses heat or chemicals.

The second dam portion 190 not only prevents the organic layer 163 fromleaking into the periphery area PA, but also prevents a metal mask fromstamping a surface of the second electrode 135 while the metal mask isused.

The spacer 129 may prevent the metal mask from stamping the surface ofthe second electrode 135 while the metal mask is used during manufactureof the encapsulation member 160. The spacer 129 may be formed in a partof the display area DA and periphery area DA.

FIGS. 6 through 9 are schematic plan views illustrating various modifieddesigns of the valley portion 120, the second electrode 135, and thecapping layer 140 formed in the first organic insulating layer 118 withrespect to the organic light-emitting display apparatus 1, according toexemplary embodiments of the present disclosure.

Referring to FIG. 6, a corner of the valley portion 120 may be round.The second electrode 135 may completely cover the valley portion 120 andthe capping layer 140 may completely cover the second electrode 135.

A distance d2 between the end of the second electrode 135 and the valleyportion 120 in a region corresponding to the corner of the display areaDA is equal to a distance d1 between the end of the second electrode 135and the valley portion 120 in a remaining region, e.g., a regioncorresponding to one side of the display area DA.

Referring to FIG. 7, the corner of the valley portion 120 may beorthogonal. The second electrode 135 may completely cover the valleyportion 120 and the capping layer 140 may completely cover the secondelectrode 135.

A distance d4 between the end of the second electrode 135 and the valleyportion 120 in the region corresponding to the corner of the displayarea DA may be smaller than a distance d3 between the end of the secondelectrode 135 and the valley portion 120 in the remaining region, e.g.,the region corresponding to one side of the display area DA.

Referring to FIG. 8, the corner of the valley portion 120 may beconcave. For example, the valley portion 120 may include a regionconcave in a shape of “L” at the corner. The second electrode 135completely covers the valley portion 120 and the capping layer 140completely covers the second electrode 135.

A distance d6 between the end of the second electrode 135 and the valleyportion 120 in the region corresponding to the corner of the displayarea DA may be smaller than a distance d5 between the end of the secondelectrode 135 and the valley portion 120 in the remaining region, e.g.,the region corresponding to one side of the display area DA.

Referring to FIG. 9, the valley portion 120 may include a region inwhich the second electrode 135 protrudes farther from the display areaDA. This region may be disposed at the corner. The second electrode 135completely covers the valley portion 120 and the capping layer 140completely covers the second electrode 135.

A distance d8 between the end of the second electrode 135 and the valleyportion 120 in the region corresponding to the corner of the displayarea DA may be smaller than or larger than a distance d7 between the endof the second electrode 135 and the valley portion 120 in the remainingregion, e.g., the region corresponding to one side of the display areaDA.

According to the design of FIGS. 6 through 9, an area of the secondelectrode 135 may be optimized. Also, by optimizing the area of thesecond electrode 135, an area of the capping layer 140 completelycovering the second electrode 135 may be optimized. By optimizing theareas of the second electrode 135 and the capping layer 140, amounts ofmaterials being used may be reduced or a design of the periphery area PAmay be optimized.

FIG. 10 is a schematic plan view of a part of an organic light-emittingdisplay apparatus 3, according to an exemplary embodiment of the presentdisclosure.

The organic light-emitting display apparatus 3 of FIG. 10 is differentfrom the organic light-emitting display apparatus 1 of FIG. 3 instructures of a second organic insulating layer 319 and second electrode335.

The second organic insulating layer 319 does not include an openingexposing the top surface of the connection conductive line 150 (see thefourth opening 119 h 4 of FIG. 2), unlike the organic light-emittingdisplay apparatus 1 of FIG. 3. Accordingly, the second electrode 335does not contact the connection conductive line 150 through the openingformed in the second organic insulating layer 319. When the opening isformed in the second organic insulating layer 319, a gas generated bythe second organic insulating layer 319 is discharged through theopening before the second electrode 335 is formed, but a patterningprocess of forming the opening would be performed. Accordingly, in theconfiguration illustrated in FIG. 10, gas diffusion prevention is notobtained and the patterning process is omitted.

FIG. 11 is a schematic plan view illustrating a part of an organiclight-emitting display apparatus 4, according to an exemplary embodimentof the present disclosure. The organic light-emitting display apparatus4 of FIG. 1I is different from the organic light-emitting displayapparatus 3 of FIG. 10 in a structure of a connection conductive layer450.

Since a patterning process of forming an opening (see the third opening150 h 3 of FIG. 10) in the connection conductive layer 450 is notperformed, the organic light-emitting display apparatus 4 may bemanufactured via simpler processes than the organic light-emittingdisplay apparatus 3 of FIG. 10.

In the organic light-emitting display apparatuses 1, 3, and 4, asdescribed above, a valley portion, e.g., an organic film cliff, isformed in a first organic insulating layer in a periphery area. A secondelectrode, e.g., a common electrode, is disposed outside of the valleyportion, thereby preventing diffusion of impurities. Also, a cappinglayer may be formed larger than the second electrode to completely coverthe second electrode, so as to prevent oxidization of the secondelectrode while an encapsulation member is formed.

According exemplary embodiments of the present invention, an organiclight-emitting display apparatus capable of preventing or reducingdeterioration of quality of an image during manufacture or in use may berealized.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope of the present disclosure.

What is claimed is:
 1. An organic light-emitting display apparatuscomprising: a substrate having a display area, within which an image isdisplayed using a plurality of organic light-emitting devices; a valleyportion disposed on the substrate outside of the display area, thevalley portion separating a region of an organic insulating layer; apower supply line disposed on the substrate outside of the display areaand supplying power to the plurality of organic light-emitting devices;a dam portion disposed on the substrate outside of the display area; acommon electrode of the plurality of organic light-emitting devices,covering the display area and the valley portion, and contacting thepower supply line; a capping layer covering the common electrode; and anencapsulation member disposed over the capping layer and comprising atleast one organic film and at least one inorganic film.